发明名称 |
composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico |
摘要 |
A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T 1 (µm) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). T 1 / T 0 × 100 ‰¥ 90
[In expression (1), T 0 represents the film thickness (µm) of the adhesive layer before developing treatment.] |
申请公布号 |
BRPI0917383(A2) |
申请公布日期 |
2015.11.17 |
申请号 |
BR2009PI17383 |
申请日期 |
2009.08.26 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KAZUYUKI MITSUKURA;SHIGEKI KATOGI;TAKASHI KAWAMORI;TAKASHI MASUKO |
分类号 |
C09J4/02;C09J7/00;C09J7/02;C09J163/00;C09J179/08;C09J201/00;C09J201/06;H01L21/52 |
主分类号 |
C09J4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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