发明名称 電子回路部品装着機
摘要 <p>The present invention improves an electronic circuit component mounting machine in which a mounting part that mounts the electronic circuit component on the circuit substrate is provided with a receiving part in which the electronic circuit components is received, and the receiving part is caused to move relative to the circuit substrate. The following components are carried on a head body (186) of the mounting head (132): 12 suction nozzles (172), two bulk material feeding machine (402) and a component photographing device. The components are caused to move relative to the circuit substrate. The suction nozzles receive substrate components from the bulk material feeding machine, and mount the substrate components on the circuit substrate after photographing. The number of components received in the housing (142) of the bulk material feeding machine is determined based on an upper-limit feeding number of the housing under a precondition that the number of components does not exceed a blackening limit number or preset production number of circuit substrates and component mounting number on each circuit substrate, and a component inputting device (700) inputs automatically. The inputting is carried out before mounting, and then is carried out in middle period of the mounting operation in a requiring condition.</p>
申请公布号 JP5812783(B2) 申请公布日期 2015.11.17
申请号 JP20110206453 申请日期 2011.09.21
申请人 富士機械製造株式会社 发明人 野沢 瑞穂
分类号 H05K13/00;H05K13/02 主分类号 H05K13/00
代理机构 代理人
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