发明名称 |
Rinsing agent, and method for production of hard disk substrate |
摘要 |
Provided are a rinsing agent to produce a hard disk substrate free from remaining abrasive grains as well as a pit defect on the surface thereof and a method for production of a hard disk substrate using such a rinsing agent. A rinsing agent of the present invention is rinsing solution containing colloidal silica as abrasive grains. Letting that the colloidal silica abrasive grains have a concentration C and an average grain size R (C and R are represented in weight % and nm, respectively), the concentration C and the average grain size R of the colloidal silica abrasive grains have a relation matching the following Expression (1):
12.2C+18.2 (1). |
申请公布号 |
US9187718(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
US201113812271 |
申请日期 |
2011.07.19 |
申请人 |
Toyo Kohan Co., Ltd;Kohan Kogyo Co., Ltd. |
发明人 |
Iwamoto Nobuhiro;Mukai Nobuaki;Arai Kazutaka;Kotani Ryuji |
分类号 |
C09G1/02;B24B37/04;B24B1/00;C11D17/00;C11D7/20;C11D11/00;G11B5/84;C11D3/12;C11D3/14 |
主分类号 |
C09G1/02 |
代理机构 |
McCarter & English |
代理人 |
McCarter & English |
主权项 |
1. A method for production of a hard disk substrate having a Ni—P plated layer thereon, comprising:
a rough-polishing step of rough polishing the hard disk substrate using a polishing slurry containing alumina abrasive grains; a rinsing step of rinsing the hard disk substrate using a rinsing agent comprising colloidal silica abrasive grains and sulfuric acid, wherein the colloidal silica abrasive grains have a weight percent concentration of C and an average nm grain size of R, the concentration C and the average grain size R of the colloidal silica abrasive grains being related according to the following Expression (1):
R≧2.2C+18.2 (1) wherein the average grain size R of the colloidal silica abrasive grains is from 20 to 60 nm; and wherein the concentration C of the colloidal silica abrasive grains is from 0.8 to 8.0 weight %; and a final-polishing step of final polishing the hard disk substrate using a polishing slurry containing colloidal silica abrasive grains, wherein the amount of alumina abrasive grains after the final-polishing step is 95 grains/μm2 or less. |
地址 |
Tokyo JP |