| 发明名称 | Method for producing a semiconductor module by using an adhesion carrier | ||
| 摘要 | A method for producing a semiconductor module includes providing an adhesion carrier and a plurality of circuit carriers. The adhesion carrier has an adhesive upper side and a lower side opposite the adhesive upper side. Each of the circuit carriers includes a ceramic carrier and an upper conductor layer applied to the ceramic carrier, and a circuit carrier lower side. By placing the circuit carriers onto the adhesive upper side, the circuit carrier lower side of the circuit carriers contacts and adheres to the adhesive upper side, so that a quasi-panel is formed, in which the circuit carriers are processed while preserving the quasi-panel and can then be removed from the adhesive upper side. | ||
| 申请公布号 | US9190382(B2) | 申请公布日期 | 2015.11.17 |
| 申请号 | US201414295373 | 申请日期 | 2014.06.04 |
| 申请人 | Infineon Technologies AG | 发明人 | Schmidt Michael |
| 分类号 | H01L21/00;H01L23/00;H01L21/56;H01L21/683;H01L21/66;H05K3/00;H01L21/48;H05K3/34 | 主分类号 | H01L21/00 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A method for producing a semiconductor module, the method comprising: providing an adhesion carrier having an adhesive upper side and a lower side opposite the adhesive upper side; providing a plurality of circuit carriers, each of which has a ceramic carrier, an upper conductor layer applied onto the ceramic carrier and a circuit carrier lower side; producing a quasi-panel by placing the circuit carriers onto the adhesive upper side, so that the circuit carrier lower side of the corresponding circuit carrier contacts and adheres to the adhesive upper side; processing the circuit carriers while preserving the quasi-panel; and removing the circuit carriers from the adhesive upper side. | ||
| 地址 | Neubiberg DE | ||