Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof

摘要

[Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board.;[Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.

主权项

1. A pattern forming method, comprising:
forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; irradiating the resin layer with a light in a negative pattern such that the photobase generator contained in the resin layer is activated, and that an irradiated portion of the resin layer is cured by a base generated by the photobase generator; heating the resin layer having the irradiated portion being cured; and removing by alkali development a non-irradiated portion of the resin layer such that a negatively patterned layer is formed, wherein the irradiating is performed such that, when the alkali-developable thermosetting resin composition in the irradiated portion and the alkali-developable thermosetting resin composition in the non-irradiated portion are subjected to a DSC measurement, the alkali-developable thermosetting resin composition in the irradiated portion exhibits an exothermic peak, and the alkali-developable thermosetting resin composition in the non-irradiated portion does not exhibit an exothermic peak, or the alkali-developable thermosetting resin composition in the irradiated portion and the alkali-developable thermosetting resin composition in the non-irradiated portion each exhibit an exothermic peak such that 1) an exothermic onset temperature of the alkali-developable thermosetting resin composition in the irradiated portion is lower than that of the alkali-developable thermosetting resin composition in the non-irradiated portion or 2) an exothermic peak temperature of the alkali-developable thermosetting resin composition in the irradiated portion is lower than that of the alkali-developable thermosetting resin composition in the non-irradiated portion.