Electrostatic chuck system and semiconductor fabrication device

摘要

An electrostatic chuck system comprising a chuck body 1 having a clamping face 4 for electrostatically clamping a substrate 5, an electrode portion 2 generating a clamping force on the clamping face 4, a temperature-regulating portion 3 regulating the temperature of the substrate 5 to maintain it at a predetermined level, and a controller 10 controlling the voltage applied to the electrode portion 2, wherein, prior to completion of the electrostatic clamping of the substrate 5 to the chuck body 1, a voltage waveform obtained by superimposing a first waveform, which changes in a stepwise, rectilinear, or quadratic manner between a first level and a second level having a larger absolute value than the first level, and a periodic second waveform, which may be any of a rectangular wave, a triangular wave, a saw-tooth wave, or a sine wave, is applied by the controller 10 to the electrode portion 2.

主权项

1. An electrostatic chuck system comprising a chuck body having a clamping face for electrostatically clamping a substrate, an electrode portion generating a clamping force on the clamping face, a temperature-regulating portion regulating the temperature of the substrate to maintain it at a predetermined level, and a controller controlling the voltage applied to the electrode portion, wherein, prior to completion of the electrostatic clamping of the substrate to the chuck body, the controller applies voltage to the electrode portion based on a voltage waveform obtained by superimposing a first waveform, which changes in a stepwise, rectilinear, or quadratic manner between a first level and a second level of a larger absolute value than the first level, and a periodic second waveform, which may be any of a rectangular wave, a triangular wave, a saw-tooth wave, or a sine wave.