Semiconductor package structure and semiconductor process

摘要

The semiconductor package includes a substrate, a plurality of components, an interposer, an electrical interconnect and a first package body. The substrate has a first surface and a second surface opposite to the first surface. A first component is mounted on the first surface of the substrate, and a second component is mounted on the second surface of the substrate. The interposer has a first surface. The electrical interconnect connects the first surface of the interposer to the second surface of the substrate. The first package body is disposed on the second surface of the substrate and encapsulates the second component, the electrical interconnect and at least a portion of the interposer.

主权项

1. A semiconductor package, comprising:
a substrate having a first surface and a second surface opposite to the first surface; a plurality of components including a first component mounted on the first surface of the substrate, and a second component mounted on the second surface of the substrate; an interposer having a first surface; an electrical interconnect connecting the first surface of the interposer to the second surface of the substrate; and a first package body disposed on the second surface of the substrate and encapsulating the second component, the electrical interconnect and at least a portion of the interposer; wherein a sum of a thickness of the interposer and a height of the electrical interconnect is substantially equal to a height of the first package body; and wherein a lateral surface of the substrate, a lateral surface of the interposer, and a lateral surface of the first package body are substantially coplanar.