| 发明名称 | IC chip package disabling device | ||
| 摘要 | A chip package comprises: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate. | ||
| 申请公布号 | US9189656(B1) | 申请公布日期 | 2015.11.17 |
| 申请号 | US201414553183 | 申请日期 | 2014.11.25 |
| 申请人 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | 发明人 | Baker Brian A.;Megarity William M.;Remis Luke D.;Wood Christopher L. |
| 分类号 | G01F17/00;G06F21/76;G06F21/55 | 主分类号 | G01F17/00 |
| 代理机构 | Law Office of Jim Boice | 代理人 | Law Office of Jim Boice |
| 主权项 | 1. A chip package comprising: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate. | ||
| 地址 | Singapore SG | ||