| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a WLP-type acoustic wave device in which a problem caused by a member disposed on a top face of a cover is unlikely to occur, and which is adaptive to downsizing, and a method of manufacturing the same.SOLUTION: The acoustic wave device includes: a substrate 3 for acoustic wave propagation; an excitation electrode disposed on a principal surface of the substrate and for acoustic wave generation; and a cover 5 disposed on the principal surface of the substrate 3 and for covering the excitation electrode. The cover 5 includes: a first principal surface 5a which is a surface at a side of the principal surface of the substrate 3; and a second principal surface 5b which is a surface at a side opposite to the first principal surface 5a. The outer edge 13 of the first principal surface 5a is positioned inside the principal surface 3a of the substrate 3, and the second principal surface 5b includes an expansion region 10 of which the outer edge is positioned outside an outer edge 12 of the first principal surface 5a. Thus, while an entire structure adapts to downsizing, a space for disposing a terminal for electrically connecting the excitation electrode to an external circuit or a reinforcing layer to be formed in the cover as a reinforcing member for preventing deformation of a vibration space of the excitation electrode can be secured on the second principal surface of the cover.</p> |
