| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a case mold type capacitor capable of achieving downsizing and height reduction of a device, in which the capacitor is used, with a simple structure.SOLUTION: A capacitor element 2 is housed in a resin case 1 having an opening 1a. A filler 4 fills the resin case 1 and thereby seals the capacitor element 2 to improve heat resistance and moisture resistance. A recessed part (a dimple) 4a is formed on a surface (a sealing surface) exposed from the opening 1a of the filler 4. A tip of a protruding part of an adjacent component, which is disposed on a case mold type capacitor so as to be located adjacent to the capacitor, is inserted into the recessed part 4a.</p> |
