发明名称 Spring loaded lid
摘要 A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed lacked position, where the locking lever forces the lid down against the socket contacts against a spring.
申请公布号 US9192070(B2) 申请公布日期 2015.11.17
申请号 US201113984168 申请日期 2011.02.28
申请人 Hewlett-Packard Development Company, L.P. 发明人 Tan Chong S;Hastings Robert J;Allen Joseph R;Gill Michael T.;Smith Kelly K;Sauer Keith A
分类号 H05K7/10;H05K7/18;H05K13/00 主分类号 H05K7/10
代理机构 Hewlett-Packard Patent Department 代理人 Hewlett-Packard Patent Department
主权项 1. An apparatus, comprising: a frame to be attached to a primary surface of a PC board; a first locking lever mounted in the frame and configured to be rotated between an open position and a closed, position wherein the first locking lever is mounted on one side of the frame: a lid, the lid having a hinge pin on one side of the lid; the frame having a pivot channel formed near the first locking lever wherein the hinge pin couples to the pivot channel and allows the lid to pivot between an open position and a closed position, the pivot channel having a length d between a top end and a bottom end of the pivot channel; at least one spring, the at least one spring acting to force the hinge pin towards the top end of the pivot channel; wherein the hinge pin is forced down towards the bottom end of the pivot channel when the lid is in the closed position and the first locking lever is moved from its open position into its closed position.
地址 Houston TX US