Stacked semiconductor packages

摘要

Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

主权项

1. A method of fabricating a stacked semiconductor package, comprising:
mounting at least one first semiconductor device on a first printed circuit board to form a first semiconductor package; mounting at least one second semiconductor device on a second printed circuit board to form a second semiconductor package; stacking the second semiconductor package on the first semiconductor package; forming a first through electrode that electrically connects the second semiconductor package to the first printed circuit board through the at least one first semiconductor device; and coupling the first through electrode of the at least one first semiconductor device to an external terminal of the second printed circuit board.