Semiconductor apparatus and test method thereof

摘要

A semiconductor apparatus includes a test voltage application unit, a first pad and a second pad. The test voltage application unit is configured to apply a test voltage to first and second TSVs in response to a test mode signal. The first pad is configured to output a first test signal outputted from the first TSV. And the second pad is configured to output a second test signal outputted from the second TSV.

主权项

1. A semiconductor apparatus which includes a plurality of chips stacked therein and first and second through-silicon vias (TSVs) electrically connecting the plurality of chips, comprising:
a test voltage application unit configured to apply a test voltage to the first and second TSVs in response to a test mode signal; a first pad configured to output a first test signal outputted from the first TSV; and a second pad configured to output a second test signal outputted from the second TSV, wherein the first and second test signals are outputted to the outside of the semiconductor apparatus through the first and second pads, respectively, substantially at the same time.