| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can connect inner leads in a semiconductor device with increased downsizing and increased high density.SOLUTION: A semiconductor device comprises: a plurality of leads having inner leads 111A and outer leads 111B; a semiconductor chip 124 provided on the plurality of leads; a spacer 130 sandwiched between the semiconductor chip 124 and the plurality of leads, for forming a clearance between a rear face of the semiconductor chip 124 and the plurality of leads; and wires 140 provided in the clearance, for electrically connecting the inner leads under the rear face of the semiconductor chip 124. |
