发明名称 |
Interconnection structures and fabrication method thereof |
摘要 |
A method is provided for fabricating an interconnection structure. The method includes providing a substrate having certain semiconductor devices, a metal layer electrically connecting with the semiconductor devices, and a barrier layer on the metal layer. The method also includes forming a dielectric layer on the substrate; and forming an antireflective coating on the dielectric layer. Further, the method includes forming a second mask having a first pattern corresponding to a through hole in the dielectric layer, wherein the antireflective coating significantly reduces lithographic light reflection to avoid photoresist residue in the first pattern; and forming a through hole by etching the dielectric layer and the antireflective coating covering the dielectric layer using the second mask as an etching mask. Further, the method also includes forming a via by filling the through hole with a conductive material. |
申请公布号 |
US9190317(B2) |
申请公布日期 |
2015.11.17 |
申请号 |
US201314020795 |
申请日期 |
2013.09.07 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
Zhou Ming |
分类号 |
H01L21/768;H01L23/48;H01L21/02;H01L21/027;H01L21/311 |
主分类号 |
H01L21/768 |
代理机构 |
Anova Law Group, PLLC |
代理人 |
Anova Law Group, PLLC |
主权项 |
1. A method for fabricating an interconnection structure, comprising:
providing a substrate having certain semiconductor devices, a metal layer electrically connecting with the semiconductor devices, and a barrier layer on the metal layer; forming a dielectric layer on the substrate; forming a black diamond hard mask on the dielectric layer; forming an antireflective coating made of silicon oxynitride (SiON) on the black diamond hard mask that is on the dielectric layer; forming a second mask having a first pattern corresponding to a through hole, wherein the antireflective coating significantly reduces lithographic light reflection to avoid photoresist residue in the first pattern; forming a through hole by etching the dielectric layer and the antireflective coating covering the dielectric layer using the second mask as an etching mask; and forming a via by filling the through hole with a conductive material. |
地址 |
Shanghai CN |