| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonder and a die bonding method which have high production capability and achieve low cost. <P>SOLUTION: A die bonder includes: a wafer supply part picking up a die, a die bonding part heating the die to a predetermined temperature; a bonding head reciprocating between the wafer supply part and the die bonding part passing on a predetermined path and including a collet which absorbs the die and crimps the die to a substrate placed on the die bonding part; and a control part controlling the overall operation of the die bonder. In a die bonding method, the control part of the die bonder causes the collet to absorb air at a predetermined suction flow rate while the bonding head moves to a first predetermined position on the predetermined path passing the predetermined path after crimping the die to the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
