发明名称 プラズマエッチング装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a plasma etching apparatus which improves the removal efficiency of an etching product adhering to a dielectric window while inhibiting the state of plasma generated by a dielectric antenna from changing. <P>SOLUTION: A plasma etching apparatus 10 comprises: a vacuum tank C housing a substrate S and sealed by a dielectric window 12; a dielectric antenna 21 disposed above the dielectric window 12 and generating plasma in the vacuum tank C; and a current suppression coil 24 connecting with the dielectric antenna 21 and suppressing a current flowing through the dielectric antenna 21. Further, the plasma etching apparatus 10 includes a high frequency power source for an antenna 22 which supplies high frequency electric power to a capacitive electrode 26, the dielectric antenna 21, and the current suppression coil 24 through a rectifier for an antenna 23. The rectifier for the antenna 23 connects a series circuit composed of the dielectric antenna 21 and the current suppression coil 24 with a parallel circuit composed of the capacitive electrode 26. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5813407(B2) 申请公布日期 2015.11.17
申请号 JP20110169331 申请日期 2011.08.02
申请人 株式会社アルバック 发明人 小風 豊;植田 昌久
分类号 H01L21/3065;H05H1/46 主分类号 H01L21/3065
代理机构 代理人
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