Heat dissipating assembly and mold having the same

摘要

A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.

主权项

1. A heat dissipating assembly of a mold, the heat dissipating assembly comprising:
an angular pin defining a receiving chamber therein, the angular pin configured to be driven to slide in the mold by a guide pin; a heat pipe totally received in the receiving chamber of the angular pin, wherein the heat pipe comprises a condensing section, an evaporation section and a connecting section interconnecting the condensing section and the evaporation section; and a liquid passage formed in the mold and passing through a lower portion of the receiving chamber of the angular pin, wherein at least the evaporation section is embedded in an upper portion of the receiving chamber of the angular pin, and the condensing section is located in the lower portion of the receiving chamber.