METAL FOIL-CLAD ADHESIVE SHEET, METAL FOIL-CLAD LAMINATE, METAL FOIL-CLAD MULTILAYER SUBSTRATE, CIRCUIT-BOARD PRODUCTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a metal foil-clad adhesive sheet that can also cope with the miniaturization of a wiring pattern of a circuit-board and in addition, can reduce the production cost of the circuit-board also corresponding to the collective lamination molding.SOLUTION: The metal foil-clad sheet comprises a metal foil 2, a release layer 3 provided on the metal foil 2, and an adhesive layer 4 provided on the release layer 3 and formed of a thermosetting resin composition in semi-cured state; and in which, setting the peel strength at the interface between metal foil 2 and release layer 3 as P1 and the peel strength at the interface between release layer 3 and adhesive layer 4 after setting as P2, P1>P2 is satisfied.