封装基板及其制法;PACKAGE SUBSTRATES AND METHODS FOR FABRICATING THE SAME

摘要

一种封装基板及其制法，该制法包括提供一具有相对之第一表面与第二表面的基板本体，该第一表面上形成有复数第一电性连接垫，并于该等第一电性连接垫上接置一金属板，再图案化该金属板，以于各该第一电性连接垫上对应定义出一金属柱。本发明能有效改善金属柱之毛边问题及金属柱的高度不一问题。; and disposing a metal plate on the plurality of first electric connection pads, then patterning the metal plate so as to define a metal column corresponding to each first electric connection pad. According to the present invention, drawbacks of raw edges and unequal heights of the metal columns can be obviated.