形成介层孔用之感光性绝缘膜以及使用该绝缘膜形成介层孔的方法;PHOTOSENSITIVE INSULATING FILM FOR FORMING VIA HOLE, AND METHOD FOR FORMING VIA HOLE USING THE SAME

摘要

一种形成介层孔用的感光性绝缘膜可包含：基底基板；第一绝缘膜，安置于所述基底基板上；以及第二绝缘膜，安置于所述第一绝缘膜上，其中所述第一绝缘膜具有比所述第二绝缘膜的感光性高的感光性。可形成穿透所述第一绝缘膜以及所述第二绝缘膜的介层孔，且所述介层孔可具有所述介层孔的上直径大于其下直径的锥形形状。; a first insulating film disposed on the base substrate; and a second insulating film disposed on the first insulating film, wherein the first insulating film has higher photosensitivity than that of the second insulating film. A via hole penetrating through the first insulating film and the second insulating film may be formed, and the via hole may have a tapering shape in which an upper diameter of the via hole is larger than a lower diameter thereof.