发明名称 MOLDING DEVICE AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a molding device that has good heat energy efficiency and can be reduced in size, and a molding method.SOLUTION: A molding device 1 includes a stage 2, a tape conveying mechanism 6 that conveys a flexible molding material 10 to a molding position on the stage 2, a hot air blowing mechanism 7 that blows a heated gas to a tip portion of the molding material 10 conveyed to the molding position, and a moving mechanism 4 that relatively moves the molding position to the stage.
申请公布号 JP2015202591(A) 申请公布日期 2015.11.16
申请号 JP20140081875 申请日期 2014.04.11
申请人 SEIKO EPSON CORP 发明人 KOGA YOSHIRO;MIYASHITA TAKESHI;KAMAKURA TOMOYUKI
分类号 B29C67/00 主分类号 B29C67/00
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