| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin useful for insulation material for electric and electronic components (highly reliable semiconductor sealants or the like), and laminate agents, coatings or the like, the epoxy resin capable of giving cured products having excellent thermal conductivity, and a curable resin composition using the same.SOLUTION: This invention provides an epoxy resin represented by formula (1) where a plurality of Xs includes at least one substituted or unsubstituted biphenyl bond group, and n is the number of repetitions with its average value 0<n<50. |
