| 摘要 |
Provided is a film forming apparatus including multiple plasma guns and equalizing film thickness. The film forming apparatus (1) including multiple plasma guns comprises a potential gradient generating part (7) generating a gradient of a potential between a hearth part (20) and a treated object arrangement part. The potential gradient generating part (7) generates the gradient of the potential to limit movement of ionized film formation material particles to change the energy and flow rate distribution of the ionized film formation material particles, thereby controlling the thickness of the film formation material attached to a treated object. |
