发明名称 |
树脂组成物、树脂薄片、树脂薄片硬化物、树脂薄片积层体、树脂薄片积层体硬化物及其制造方法、半导体装置以及LED装置;RESIN COMPOSITION, RESIN SHEET, HARDENED RESIN SHEET, LAMINATED RESIN SHEET, HARDENED LAMINATED RESIN SHEET AND PRODUCTION METHOD THEREOF, SEMICONDUCTOR DEVICE AND LED DEVICE |
摘要 |
一种树脂组成物,其含有:3官能以上之第1环氧树脂,其分子中具有包含两个萘环且前述两个萘环经伸烷基链所连结之结构;2官能之第2环氧树脂,其分子中具有液晶基结构;及,硬化剂。; a second epoxy resin containing, in a molecule, a mesogenic structure and including two functional groups; and a curing agent. The present invention also provides a resin sheet, a hardened resin sheet, a laminated resin sheet, a hardened laminated resin sheet and a production method thereof, a semiconductor device and a LED device using the resin composition. |
申请公布号 |
TW201542672 |
申请公布日期 |
2015.11.16 |
申请号 |
TW104109021 |
申请日期 |
2015.03.20 |
申请人 |
日立化成股份有限公司 HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
西山智雄 NISHIYAMA, TOMOO;原直树 HARA, NAOKI;吉江重充 YOSHIE, SHIGEMITSU;桑野敦司 KUWANO, ATSUSHI |
分类号 |
C08L63/00(2006.01);C08G59/38(2006.01);C08G59/62(2006.01);C08J5/18(2006.01);C08J7/00(2006.01);B32B15/092(2006.01);B32B27/38(2006.01);B32B38/16(2006.01);C09K5/14(2006.01);H01L23/36(2006.01);H01L33/64(2010.01) |
主分类号 |
C08L63/00(2006.01) |
代理机构 |
|
代理人 |
蔡坤财李世章 |
主权项 |
|
地址 |
日本 JP |