发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of improving barrier height between an electrode layer and a semiconductor layer.SOLUTION: A method for manufacturing a semiconductor device comprises a step of forming a first electrode layer which forms Schottky junction with at least part of a semiconductor layer and mainly being formed of nickel; a step of performing heat treatment after formation of the first electrode layer; and a step of forming a second electrode layer mainly formed of at least one metal selected from palladium, platinum and iridium, on the first electrode layer after the heat treatment. |
申请公布号 |
JP2015204335(A) |
申请公布日期 |
2015.11.16 |
申请号 |
JP20140082150 |
申请日期 |
2014.04.11 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
HASEGAWA KAZUYA;OKA TORU;TANAKA SHIGEAKI |
分类号 |
H01L29/872;H01L21/28;H01L21/329;H01L29/06;H01L29/47 |
主分类号 |
H01L29/872 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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