发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of improving barrier height between an electrode layer and a semiconductor layer.SOLUTION: A method for manufacturing a semiconductor device comprises a step of forming a first electrode layer which forms Schottky junction with at least part of a semiconductor layer and mainly being formed of nickel; a step of performing heat treatment after formation of the first electrode layer; and a step of forming a second electrode layer mainly formed of at least one metal selected from palladium, platinum and iridium, on the first electrode layer after the heat treatment.
申请公布号 JP2015204335(A) 申请公布日期 2015.11.16
申请号 JP20140082150 申请日期 2014.04.11
申请人 TOYODA GOSEI CO LTD 发明人 HASEGAWA KAZUYA;OKA TORU;TANAKA SHIGEAKI
分类号 H01L29/872;H01L21/28;H01L21/329;H01L29/06;H01L29/47 主分类号 H01L29/872
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