| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a multilayer substrate capable of reducing a chip defect caused by exfoliation of a first substrate regardless of a workpiece.SOLUTION: The processing method of the multilayer substrate in which a second substrate is stuck on the first substrate via an adhesive layer and a plurality of streets each having a predetermined width are set includes a laser processing groove forming step and a cutting step. In the laser processing groove forming step, the multilayer substrate is irradiated with a laser beam of a wavelength having absorptivity from a side of the second substrate along the streets and a pair of laser processing grooves each reaching the first substrate are formed at both sides within the width of the streets. After the laser processing groove forming step is implemented, in the cutting step, a region held between the pair of laser processing grooves within the street is cut by a cutting blade of which the width does not protrudes from the pair of laser processing grooves. |
