PROCESSING METHOD OF OPTICAL DEVICE WAFER

摘要

PROBLEM TO BE SOLVED: To provide a processing method of an optical device wafer capable of destroying a buffer layer by efficiently transmitting a laser beam from a rear face of an epitaxy substrate without processing the rear face of the epitaxy substrate into a mirror surface.SOLUTION: The processing method of the optical device wafer in which an optical device layer is laminated on a front face of the epitaxy substrate via the buffer layer, includes: a transfer substrate bonding step of bonding a transfer substrate to a front face of the optical device layer of the optical device wafer via a bonding material; a buffer layer destruction step of destroying the buffer layer by irradiating the buffer layer with a pulse laser beam of a wavelength having transmissivity for the epitaxy substrate and absorptivity for the buffer layer from a rear face side of the epitaxy substrate of the optical device wafer; and an optical device layer transfer step of transferring the optical device layer to the transfer substrate by exfoliating the epitaxy substrate from the optical device layer after the buffer layer destruction step is implemented. Before implementing the buffer layer destruction step, a resin coating step is implemented for flattening the rear face of the epitaxy substrate by coating the rear face of the epitaxy substrate with a resin through which the laser beam is transmissive.