发明名称 PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which allows for enhancement of soldering reliability of an electronic component to a land, and to provide a method of manufacturing a printed circuit.SOLUTION: A printed wiring board 1 includes a first land 21 of closed shape provided on a substrate body 10, a second land 22 connected with the first land, and provided on the substrate body so as to surround the first land, and third lands 23E, 24E connected with the second land, and provided on the substrate body so as to project farther outside than the outer shape of a predetermined electronic component 4 mounted on the first land and second land. The predetermined electronic component 4 has a detector for detecting a predetermined physical quantity, at a position (1H) corresponding to the first land.
申请公布号 JP2015204380(A) 申请公布日期 2015.11.16
申请号 JP20140083081 申请日期 2014.04.14
申请人 NIPPON MEKTRON LTD 发明人 FUJIMURA TAKASHI;OKABE YUYA
分类号 H05K3/34;H05K1/18 主分类号 H05K3/34
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