发明名称 SILICON WAFER POLISHING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a silicon wafer polishing composition superior in the effect of reducing haze, and filterability.SOLUTION: Provided is a silicon wafer polishing composition which comprises: a polymer X including an amide group; and an organic compound Y including no amide group. The polymer X including an amide group has, in its main chain, a constitutional unit A originating from a monomer expressed by the general formula (1) below. The relation between the molecular weight Mof the polymer X including an amide group, and the molecular weight Mof organic compound Y satisfies the following expression: 200&le;M<M.
申请公布号 JP2015204370(A) 申请公布日期 2015.11.16
申请号 JP20140082951 申请日期 2014.04.14
申请人 FUJIMI INC 发明人 TSUCHIYA KOSUKE;TANSHO HISANORI;MORI YOSHIO
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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