发明名称 SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment method that reduces flaws on a substrate surface.SOLUTION: The substrate treatment method includes: a step of polishing a surface of a polishing object provided on the substrate W on a polishing pad 3 to which slurry is supplied from a slurry supply part 5; a step of polishing the surface of the polishing object on the polishing pad 3 while supplying water to the polishing pad 3 from a water supply part 6 after the polishing step using the slurry; and a step of cleaning the surface of the polishing object on the polishing pad 3 while supplying cleaning fluid to the polishing pad 3 from a cleaning fluid supply part 7 after the polishing step using the water.
申请公布号 JP2015202526(A) 申请公布日期 2015.11.16
申请号 JP20140081988 申请日期 2014.04.11
申请人 TOSHIBA CORP 发明人 OTSUKA YOSUKE;KODERA MASAKO;MATSUI YUKITERU
分类号 B24B37/04;C11D7/26;C11D7/32;H01L21/304 主分类号 B24B37/04
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