发明名称 |
SUBSTRATE TREATMENT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment method that reduces flaws on a substrate surface.SOLUTION: The substrate treatment method includes: a step of polishing a surface of a polishing object provided on the substrate W on a polishing pad 3 to which slurry is supplied from a slurry supply part 5; a step of polishing the surface of the polishing object on the polishing pad 3 while supplying water to the polishing pad 3 from a water supply part 6 after the polishing step using the slurry; and a step of cleaning the surface of the polishing object on the polishing pad 3 while supplying cleaning fluid to the polishing pad 3 from a cleaning fluid supply part 7 after the polishing step using the water. |
申请公布号 |
JP2015202526(A) |
申请公布日期 |
2015.11.16 |
申请号 |
JP20140081988 |
申请日期 |
2014.04.11 |
申请人 |
TOSHIBA CORP |
发明人 |
OTSUKA YOSUKE;KODERA MASAKO;MATSUI YUKITERU |
分类号 |
B24B37/04;C11D7/26;C11D7/32;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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