| 摘要 |
<p>DISCLOSED IN THIS SPECIFICATION IS A LEAD-FREE SOLDERING ALLOY MADE OF GOLD, TIN AND INDIUM. THE TIN IS PRESENT IN A CONCENTRATION OF 17.5% TO 20.5%, THE INDIUM IS PRESENT IN A CONCENTRATION OF 2.0% TO 6.0% AND THE BALANCE IS GOLD AND THE ALLOY HAS A MELTING POINT BETWEEN 290 °C AND 340 °C AND PREFERABLY BETWEEN 300 °C AND 340 °C. THE SOLDERING ALLOY IS PARTICULARLY USEFUL FOR HERMETICALLY SEALING SEMICONDUCTOR DEVICES SINCE THE MELTING TEMPERATURE IS SUFFICIENTLY HIGH TO PERMIT POST-SEAL HEATING AND SUFFICIENTLY LOW TO ALLOW SEALING OF THE SEMICONDUCTOR WITHOUT CAUSING DAMAGE.</p> |
