发明名称 FILM FORMING METHOD
摘要 In order to form a film on a substrate by repeating a cycle of the adsorption of materials and the oxidation of the materials, provided is technology, capable of sufficiently oxidizing the substrate without a heating tool for heating the substrate; and obtaining an oxide film having good quality. The film forming method, capable of obtaining a film by laminating a molecular layer of oxide on a surface of the substrate in a vacuum state, is performed by repeating a material gas supply gas of supplying material gas to the substrate in a vacuum container to absorb a material on the substrate; an ozone atmosphere forming step of forming an ozone atmosphere having higher concentration than the concentration of a chain decomposition reaction in the vacuum container; and an oxidation process of generating an active species of oxygen by forcibly discomposing ozone by supplying energy to the ozone atmosphere, and obtaining an oxide by oxidizing the material, absorbed on the substrate, with the active species.
申请公布号 KR20150126775(A) 申请公布日期 2015.11.13
申请号 KR20150055836 申请日期 2015.04.21
申请人 TOKYO ELECTRON LIMITED;IWATANI CORPORATION 发明人 YABE KAZUO;SHIMIZU AKIRA;IZUMI KOICHI;FURUTANI MASAHIRO
分类号 H01L21/316;H01L21/314 主分类号 H01L21/316
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