| 摘要 |
DISCLOSED IS A RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR CONTAINING A CURING AGENT, AN EPOXY RESIN (B) AND AN INORGANIC FILLER (C), WHEREIN THE CURING AGENT IS A PHENOL RESIN (A) HAVING A PREDETERMINED STRUCTURE. ALSO DISCLOSED IS A SEMICONDUCTOR DEVICE OBTAINED BY ENCAPSULATING A SEMICONDUCTOR ELEMENT WITH A CURED PRODUCT OF THE RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR. |
