| 摘要 |
<p>The board (10) has conductor paths (16) formed on an upper surface (14) and a lower surface. A recess (20) is formed in a carrier material e.g. flame retardent-4-material, of the board using milling or laser machining process and opened in a side surface (18), which borders the upper surface of the board. A radio frequency identification (RFID) transponder with a RFID-microchip (12) is inserted into the recess that is filled with a filling material e.g. epoxide resin, which has different properties than the carrier material.</p> |
