| 摘要 |
The present invention relates to a gas pipe for a semiconductor manufacturing facility, capable of forming a piping facility to transfer gas in a semiconductor manufacturing facility so that gas pipes are smoothly installed in a space in which the pipes are not able to be installed and loaded as a construction space is not secured due to an obstacle. The present invention comprises: a pair of inner pipe assemblies forming an inner pipe with a gas transfer space, forming a coating layer of a Viton material on the outer surface, having a cross section in a semicircular shape, and having combination piece at the side ends, extended to the outside; and a pair of outer pipe assemblies forming an outer pipe surrounding the inner pipe, formed by the combination of the inner pipe assemblies, including a coating layer of the Viton material inside, and including a flange piece including a combination groove having a semicircular shape, extended to the outside, and combined with the combination piece. An assembly piece, extended to the outside and including multiple fixing holes combined with bolts, is formed on surfaces of the outer pipe assemblies, attached to each other. Multiple combination holes to be combined with a flange of other pipes through the bolts are formed on the flange piece. |
