COOLING APPARATUS USING THERMOELEMENT MODULE

摘要

The present invention relates to a cooling structure of a cooling apparatus and, more specifically, to a cooling structure of a cooling apparatus for cooling a heat dissipation unit of a cooling apparatus using a thermoelectric module. The cooling apparatus using a thermoelectric module comprises: a thermoelectric module unit including a first heat exchange unit and a second heat exchange unit; a first housing (100) having an inner space to accommodate the first heat exchange unit; a second housing (200) coupled to the first housing (100); and a second flow formation unit (240) for forming an air flow in a second flow path (P2).