| 发明名称 |
INTEGRATED CIRCUIT |
| 摘要 |
An integrated circuit (IC) is provided. The IC includes a chip, a passivation layer, a first metal internal connection, a routing wire and a bonding area. The passivation layer is disposed on the chip, wherein the passivation layer has a first opening. The first metal internal connection is disposed under the passivation layer and disposed in the chip. The routing wire is disposed on the passivation layer, wherein a first end of the routing wire electrically connects to a first end of the first metal internal connection through the first opening of the passivation layer. The bonding area is disposed on the passivation layer, wherein the bonding area electrically connects to a second end of the routing wire. |
| 申请公布号 |
US2015325537(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201514697631 |
申请日期 |
2015.04.28 |
| 申请人 |
Novatek Microelectronics Corp. |
发明人 |
Lu Kuo-Yuan;Chou Wen-Ping;Chen Yung-Sheng |
| 分类号 |
H01L23/00;H01L23/528;H01L23/532;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit, comprising:
a chip; a passivation layer, disposed on the chip, wherein the passivation layer has a first opening; a first metal internal connection, disposed under the passivation layer and disposed in the chip; a routing wire, disposed on the passivation layer, wherein a first end of the routing wire electrically connects to a first end of the first metal internal connection through the first opening of the passivation layer; and a bonding area, disposed on the passivation layer, wherein the bonding area electrically connects to a second end of the routing wire. |
| 地址 |
Hsinchu TW |
