SEMICONDUCTOR PACKAGE FOR RADIO COMMUNICATION AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package for radio communication may include a substrate, and a plurality of electronic devices mounted on both surfaces of the substrate. The electronic devices running on the same frequency band among the plurality of electronic devices may be separately mounted on the both surfaces of the substrate. A method of manufacturing a semiconductor package for radio communication may include preparing a substrate, mounting at least one or more electronic devices on an upper surface of the substrate, and mounting at least one or more electronic devices on a lower surface of the substrate. The electronic devices of the same frequency band among the electronic devices may be separately mounted on the upper and lower surfaces of the substrate.

主权项

1. A semiconductor package for radio communication, the semiconductor package comprising:
a substrate; and a plurality of electronic devices mounted on both surfaces of the substrate, wherein the electronic devices using the same frequency band among the plurality of electronic devices are separately mounted on the both surfaces of the substrate.