CORELESS PACKAGING SUBSTRATE, POP STRUCTURE, AND METHODS FOR FABRICATING THE SAME

摘要

A method for fabricating a coreless packaging substrate is provided, which includes: forming a dielectric layer on a conductive plate having a plurality of conductive pads; forming a circuit layer on the dielectric layer and forming in the dielectric layer a plurality of conductive vias that electrically connect the circuit layer and the conductive pads; and removing a portion of the conductive plate so as to cause the remaining portion of the conductive plate to form a plurality of conductive elements, thereby dispensing with a core layer and reducing the material and fabrication cost.

主权项

1. A coreless packaging substrate, comprising:
a dielectric layer having opposite first and second surfaces; a plurality of conductive pads embedded in the dielectric layer and exposed from the first surface of the dielectric layer; a plurality of conductive elements bonded to the conductive pads and protruding above the first surface of the dielectric layer, wherein the conductive elements are made of a non-solder material; a circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer and electrically connecting the circuit layer and the conductive pads.