发明名称 INTEGRATED PACKAGE CONTAINING MEMS ACOUSTIC SENSOR AND ENVIRONMENTAL SENSOR AND METHODOLOGY FOR FABRICATING SAME
摘要 An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
申请公布号 US2015321906(A1) 申请公布日期 2015.11.12
申请号 US201414273845 申请日期 2014.05.09
申请人 INVENSENSE, Inc. 发明人 Tsai Julius Ming-Lin;Cagdaser Baris;Lim Martin;Khenkin Aleksey S.
分类号 B81B7/02;B81C1/00 主分类号 B81B7/02
代理机构 代理人
主权项 1. A device comprising: a package; a MEMS acoustic sensor disposed in the package; an environmental sensor disposed in the package; and a port disposed in the package configured to receive acoustic waves for the acoustic sensor and air for the environmental sensor; wherein, the package includes an acoustically sealed back cavity associated with the acoustic sensor.
地址 San Jose CA US
您可能感兴趣的专利