| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having less warpage.SOLUTION: A printed wiring board of an embodiment has: a core substrate having a first surface and a second surface; upper resin insulation layers formed on the first surface of the core substrate; and lower resin insulation layers formed on the second surface of the core substrate. The core substrate has a through hole conductor having a bonded place. The number of upper resin insulation layers is N and the number of lower resin insulation layers is K. N is larger then K and a difference between N and K is equal to or less than 3. A ratio (H1/h1) of a distance h1 between the first surface of the core substrate and a top face of the N-th upper resin insulation layer to a distance H1 between the first surface of the core substrate and a top face of the K-th lower resin insulation layer is larger than 0.75 and smaller than 2.4. |
