发明名称 SEMICONDUCTOR DEVICE COMPRISING A GRAPHENE WIRE
摘要 According to one embodiment, a semiconductor device includes a catalyst underlying layer formed on a substrate including semiconductor elements formed thereon and processed in a wiring pattern, a catalyst metal layer that is formed on the catalyst underlying layer and whose width is narrower than that of the catalyst underlying layer, and a graphene layer growing with a sidewall of the catalyst metal layer set as a growth origin and formed to surround the catalyst metal layer.
申请公布号 US2015325524(A1) 申请公布日期 2015.11.12
申请号 US201514803751 申请日期 2015.07.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 WADA Makoto;YAMAZAKI Yuichi;KAJITA Akihiro;ISOBAYASHI Atsunobu;SAITO Tatsuro
分类号 H01L23/532;H01L23/528 主分类号 H01L23/532
代理机构 代理人
主权项 1. A semiconductor device comprising: a metal layer provided above a substrate comprising a semiconductor element, the metal layer having a convex shape on a cross-sectional surface and extending in a first longitudinal direction; and a graphene layer provided on the metal layer to surround a side surface and an upper surface of a convex portion of the metal layer, the graphene layer having a curved cross-sectional surface and extending in a second longitudinal direction, wherein the first longitudinal direction of the metal layer conforms to the second longitudinal direction of the graphene layer.
地址 Tokyo JP
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