发明名称 |
METHODS OF PREPARING TUNGSTEN AND TUNGSTEN NITRIDE THIN FILMS USING TUNGSTEN CHLORIDE PRECURSOR |
摘要 |
Methods for forming tungsten film using fluorine-free tungsten precursors such as tungsten chlorides are provided. Methods involve depositing a tungsten nucleation layer by exposing a substrate to a reducing agent such as diborane (B2H6) and exposing the substrate to a tungsten chloride, followed by depositing bulk tungsten by exposing the substrate to a tungsten chloride and a reducing agent. Methods also involve diluting the reducing agent and exposing the substrate to a fluorine-free precursor in pulses to deposit a tungsten nucleation layer. Deposited films exhibit good step coverage and plugfill. |
申请公布号 |
US2015325475(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
US201514703732 |
申请日期 |
2015.05.04 |
申请人 |
Lam Research Corporation |
发明人 |
Bamnolker Hanna;Humayun Raashina;Gao Juwen;Danek Michal;Collins Joshua |
分类号 |
H01L21/768;C23C16/52;H01L21/285 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
1. A method of depositing tungsten on a substrate, the method comprising:
exposing the substrate to a reducing agent and hydrogen, and exposing the substrate to a tungsten chloride to deposit the tungsten, wherein the ratio of hydrogen flow rate to reducing agent flow rate is between about 10:1 and about 100:1. |
地址 |
Fremont CA US |