发明名称 METHODS OF PREPARING TUNGSTEN AND TUNGSTEN NITRIDE THIN FILMS USING TUNGSTEN CHLORIDE PRECURSOR
摘要 Methods for forming tungsten film using fluorine-free tungsten precursors such as tungsten chlorides are provided. Methods involve depositing a tungsten nucleation layer by exposing a substrate to a reducing agent such as diborane (B2H6) and exposing the substrate to a tungsten chloride, followed by depositing bulk tungsten by exposing the substrate to a tungsten chloride and a reducing agent. Methods also involve diluting the reducing agent and exposing the substrate to a fluorine-free precursor in pulses to deposit a tungsten nucleation layer. Deposited films exhibit good step coverage and plugfill.
申请公布号 US2015325475(A1) 申请公布日期 2015.11.12
申请号 US201514703732 申请日期 2015.05.04
申请人 Lam Research Corporation 发明人 Bamnolker Hanna;Humayun Raashina;Gao Juwen;Danek Michal;Collins Joshua
分类号 H01L21/768;C23C16/52;H01L21/285 主分类号 H01L21/768
代理机构 代理人
主权项 1. A method of depositing tungsten on a substrate, the method comprising: exposing the substrate to a reducing agent and hydrogen, and exposing the substrate to a tungsten chloride to deposit the tungsten, wherein the ratio of hydrogen flow rate to reducing agent flow rate is between about 10:1 and about 100:1.
地址 Fremont CA US