| 摘要 |
PROBLEM TO BE SOLVED: To provide a simply structured laser lift-off apparatus in which damage of a projection lens is prevented even when lift-off processing is applied to a small workpiece, for example when a laser lift-off process is performed after a cutting process.SOLUTION: A support substrate S2 laminated with individual chip-like workpieces W comprised of a sapphire substrate S1 and a material layer M is mounted on a work stage 4. Laser light from a laser source 1 passes through a mask 21 and is irradiated onto the individual workpieces by a projection lens 2. A projection pattern I is larger than the size of a chip-like workpiece W, and lift-off of one chip-like workpiece W is completed by one pulse. The sapphire substrate S1 flying out from the chip-like workpieces during lift-off collides with a protection member 7 disposed in the emission side of the projection lens 2; thus the projection lens 2 is protected. |
