| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting diode in which, even when energization is performed under a specific environment, migration of a lead frame base material does not occur at a contact interface between an encapsulating material and a lead frame, and brilliance does not decrease.SOLUTION: Provided is a curable resin composition for a package, which can suppress migration of a lead frame occurring at a contact interface between an encapsulating material and the lead frame by adding a specific ion capturing material to a resin composition which forms a package for a light-emitting diode, the resin composition being not directly present at the contact interface between the encapsulating material and the lead frame. The curable resin composition for a light-emitting diode package comprises as essential components: (A) a compound having at least two carbon-carbon double bonds in a molecule, having reactivity with an SiH group; (B) a compound having at least two SiH groups in one molecule; (C) a hydrosilylation catalyst; (D) an inorganic filler; (E) and hydrotalcites as an ion capturing material. |
