发明名称 FINFET AND METHOD FOR MANUFACTURING THE SAME
摘要 A FinFET and a method for manufacturing the same are provided. The method includes: patterning a semiconductor substrate to form a ridge; performing ion implantation such that a doped punch-through-stopper layer is formed in the ridge and a semiconductor fin is formed by a portion of the semiconductor substrate disposed above the doped punch-through-stopper layer; forming a gate stack intersecting the semiconductor fin, the gate stack comprising a gate conductor and a gate dielectric isolating the gate conductor from the semiconductor fin; forming a gate spacer surrounding the gate conductor; and forming source and drain regions in portions of the semiconductor fin at opposite sides of the gate stack.
申请公布号 US2015325699(A1) 申请公布日期 2015.11.12
申请号 US201214647736 申请日期 2012.12.07
申请人 INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES 发明人 Zhu Huilong;Xu Miao
分类号 H01L29/78;H01L29/10;H01L21/308;H01L21/265;H01L21/311;H01L21/02;H01L29/165;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A method for manufacturing a FinFET, comprising the steps of: patterning a semiconductor substrate to form a ridge; performing ion implantation such that a doped punch-through-stopper layer is formed in the ridge and a semiconductor fin is formed by a portion of the semiconductor substrate disposed above the doped punch-through-stopper layer; forming a gate stack intersecting the semiconductor fin, the gate stack comprising a gate conductor and a gate dielectric isolating the gate conductor from the semiconductor fin; forming a gate spacer surrounding the gate conductor; and forming source and drain regions in portions of the semiconductor fin at opposite sides of the gate stack.
地址 Beijing CN