PRODUCTION METHOD FOR ULTRASONIC PROBE, ULTRASONIC PROBE, AND ULTRASONIC DIAGNOSIS DEVICE

摘要

Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.

主权项

1. A production method for an ultrasonic probe which uses a capacitive ultrasonic transducer formed on a first primary surface of a substrate, comprising:
a step of forming a protective film on the surface of the ultrasonic transducer which is formed on the first primary surface of the substrate; a step of thinning a second primary surface side opposite to the first primary surface of the substrate, after the step of forming a protective film; a step of cutting an ultrasonic transducer chip out of the substrate after the step of thinning; a step of providing a sound absorbing material on the surface of the ultrasonic transducer chip which is opposite to the surface formed with the ultrasonic transducer, after the cutting step; and a first removal step of removing the protective film which is formed on the surface of the ultrasonic transducer, after the step of providing a sound absorbing material.