发明名称 |
APPARATUS AND METHOD FOR STRIPPING SOLDER METALS DURING THE RECYCLING OF WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT |
摘要 |
Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module. |
申请公布号 |
US2015322540(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
US201514803962 |
申请日期 |
2015.07.20 |
申请人 |
Advanced Technology Materials, Inc. |
发明人 |
CHEN Tianniu;KORZENSKI Michael B.;JIANG Ping |
分类号 |
C22B3/02;C22B3/04;C22B1/00;C22B4/00;C22B3/00;C22B7/00 |
主分类号 |
C22B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Danbury CT US |