METHOD AND DEVICE FOR MANUFACTURING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a printable semiconductor element and assembling the printable semiconductor element onto the substrate surface.SOLUTION: A printable semiconductor element 150 is brought into conformal contact with a polymer transfer device 175 or a contact surface 170 of a composite polymer transfer device, and the printable semiconductor element is brought into contact on the contact surface. The printable semiconductor element accumulated on the contact surface of a conformal contact device is brought into contact with the receiving surface of a substrate in a form where the conformal contact is performed between the contact surface and the receiving surface of the substrate 160. The contact surface is separated from the printable semiconductor element brought into contact with the receiving surface of the substrate and is assembled on the receiving surface.